These notes are a summary of concepts presented in “Circuit stickers: peel-and-stick construction of interactive electronic prototypes.”
Steve Hodges, Nicolas Villar, Nicholas Chen, Tushar Chugh, Jie Qi, Diana Nowacka, and Yoshihiro Kawahara. 2014. Circuit stickers: peel-and-stick construction of interactive electronic prototypes. In Proceedings of the SIGCHI Conference on Human Factors in Computing Systems (CHI ’14). Association for Computing Machinery, New York, NY, USA, 1743–1746. https://doi.org/10.1145/2556288.2557150
- System Details
- Adheres physical interface elements like LEDs, sounders, buttons, and sensors onto a conductive substrate
- Supports quick, versatile, and cost-effective creation of flexible interactive prototypes
- Particularly suited for experimenting with touch-sensing electrodes
- Combines with existing systems to improve usability or expand design possibilities
- Substrate Properties
- Provides electrical connectivity for attached circuits
- Creation methods
- Hand-crafted: Using conductive ink and paint
- Digitally designed: Created on a computer and printed
- Increased contact area enhances functionality and ease of use
- Sticker Types
- Generic stickers
- Contain single electronic component footprints (e.g., 0804 passive or SOT-23 transistor)
- Ideal for connecting various components to prototype new ideas
- Sub-circuit stickers
- Designed for specific electronic devices, housing small groups of components
- Generic stickers
- Bus-based stickers
- Primarily used for input and output, with computation, storage, and communication handled by external devices (e.g., microcontroller or PC)
- Features
- Inkjet-printed parallel traces form a 1-wire or I²C bus
- Carries both power and data with corresponding interfaces
- Technical Specifications
- Contact pads
- Size: Typically 10-20 mm²
- Minimum dimension: 1.5 mm
- Spacing: At least 1 mm between adjacent pads
- Sticker size
- Minimum total size: 50 mm² for mechanical stability
- Contact pads